Heat Transfer in Filamentary RRAM Devices

Article (Web of Science)

• cited authors: Niraula, Dipesh; Karpov, Victor G.
• authors: Karpov, Victor G
• publication date: October 1, 2017
• webpage: Web of Science
• published in: IEEE TRANSACTIONS ON ELECTRON DEVICES Journal

author keyword

• COMSOL
• device SET voltage
• heat transfer
• resistive random access memory (RRAM)
• switching
• thermal boundary resistance (TBR)

• category: PHYSICS, APPLIED Category
• start page: 4106
• end page: 4113
• volume: 64
• issue: 10