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Multi-scale porous copper foams as wick structures
Article (Web of Science)
International Collaboration
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cited authors
Zhang, Hongtao; Pan, Qinglin; Zhang, Hongyan
authors
Zhang, Hongyan
publication date
September 1, 2013
webpage
Web of Science
published in
MATERIALS LETTERS
Journal
Research
author keyword
Copper
Electroplating
Microstructure
Porosity
Porous materials
category
PHYSICS, APPLIED
Category
Additional Document Info
start page
360
end page
362
volume
106