Multi-scale porous copper foams as wick structures Article (Web of Science)

International Collaboration

cited authors

  • Zhang, Hongtao; Pan, Qinglin; Zhang, Hongyan

authors

publication date

  • September 1, 2013

webpage

published in

author keyword

  • Copper
  • Electroplating
  • Microstructure
  • Porosity
  • Porous materials

category

start page

  • 360

end page

  • 362

volume

  • 106