Multi-scale porous copper foams as wick structures

Article (Web of Science)

• cited authors: Zhang, Hongtao; Pan, Qinglin; Zhang, Hongyan
• authors: Zhang, Hongyan
• publication date: September 1, 2013
• webpage: Web of Science
• published in: MATERIALS LETTERS Journal

author keyword

• Copper
• Electroplating
• Microstructure
• Porosity
• Porous materials

• category: PHYSICS, APPLIED Category
• start page: 360
• end page: 362
• volume: 106