Stable stoichiometric copper nitride thin films via reactive sputtering Article (Web of Science)

cited authors

  • Islam, Md Maidul; Georgiev, Daniel G.

publication date

  • July 1, 2022

webpage

published in

category

keywords

  • Copper nitride
  • Film stability
  • Modified Tauc plot
  • Reactive sputtering
  • Resistivity
  • Scanning electron microscopy
  • X-ray diffraction

volume

  • 128

issue

  • 7